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Printed Circuit Board Assemblies

Valuetronics has experience in many methods of printed circuit board assembly from through hole and mixed technology to customized fine pitched surface mount technologies.

SMT Line
Our process capabilities include:

  • 0201 chips
  • 0.4mm fine pitch IC
  • Flip chip
  • CSPs
  • BGAs and micro -BGAs
  • Chip on Board (wire bonding)
  • Lead free assembly (RoHS compliant)
  • IN-Circuit-Test ( ICT)
  • Automatic Optical Inspection ( AOI)
  • X-Ray Inspection

PCBOur equipments include:

  • 12 SMT lines (more than 10 Millions chips placement/day)
  • Lead Free Reflow ovens
  • Lead Free Dual Wave machines
  • 13 Bonding machines

Built by Stellar Link